The Applied Tetra Reticle Clean system is the first mask cleaning system to achieve zero damage and 99% particle removal efficiency (PRE) on advanced masks for dry and immersion technologies. Today’s most productive mask stripping and cleaning system, Tetra Reticle Clean combines a mask clean chamber and a plasma dry strip and conditioning chamber on one platform to address the full range of mask cleaning challenges from photoresist strip to removing post-etch residues and particles while preserving the integrity of the photomask.

The system is unique in its streamlined mask handling, integrated dry/wet processing capabilities, and throughput at least double that of equivalent mask cleans products. The mask is handled only to enter and exit the clean chamber, where it is stripped, cleaned, rinsed, and dried without mask flipping.

Tetra Reticle Clean is the only system employing Uniform Cavitation Megasonics to enhance defect cleaning while safeguarding the physical integrity of even the smallest features. The clean chamber is designed for cleaning the front and back of the mask simultaneously, using different chemistries if necessary with no possibility of mixing. NanoDroplet Technology further enhances damage-free cleaning using an overhead nozzle designed to create uniform high-momentum "nanodroplets" and kinetic energy. Sulfur-free stripping followed by advanced cleaning chemistry outperforms standard chemistries in preserving optical properties of the mask and preventing haze formation. Tetra Reticle Clean delivers top productivity for mask cleaning applications with distinctive, integrated dry/wet processing for all mask types and feature sizes through 32nm and beyond.