The Applied Producer Etch, with its patented Twin Chamber design, answers today's demands for a reliable, cost-effective production tool for high-productivity etch applications at 90nm and below. The production-proven, highly compact etcher can be configured with up to three Twin Chambers for maximum output.

In 2008, Producer Etch added via and trench etch for advanced memory interconnect layers to its well-established base of bond pad etch, etchback, and recess applications.  This high-productivity, cost-effective system delivers >30% higher throughput and >50% longer mean time between cleans than traditional systems, while enabling customers to dramatically reduce the cost of consumables.

While offering the highest throughput density with the Twin Chambers and a two-FOUP, dual robot factory interface, Producer Etch delivers single-chamber performance and process control.  Each Twin Chamber can operate in single- or dual-wafer mode.  Etch rate, etch rate uniformity, and resist selectivity can be tuned by adjusting the gap between the electrodes, enabling process optimization for different applications. 

Efficient plasma confinement, in-situ cleaning, and high-purity plasma-resistant chamber materials produce quality performance and a mean time between wet cleans of 500 RF hours or more in a volume production environment.  Its uptime, throughput, and low cost of ownership make Producer Etch the ideal work horse for high-productivity etch applications.