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Metrology and Inspection Press Releases
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04/14/2008
04/14/2008
12/04/2007 Applied Materials' New SEMVision G4 System Sets the Benchmark with Defect-Per-Second Review at 2nm Resolution
11/26/2007 Applied Materials’ UVision 3 Sets Benchmark for Brightfield Inspection Sensitivity and Productivity
12/06/2006 Applied Materials' UVision SP Solves Defect Inspection Challenges for Immersion Lithography at CNSE's Albany NanoTech
07/03/2006 Applied Materials' UVision Inspection System and Producer HARP CVD System Win Semiconductor International Awards
07/07/2005 Applied Materials Wins Semiconductor International Magazine's Best Product Award for SEMVision G2 FIB 
06/06/2005 Applied Materials Unlocks the Future of Defect Inspection with Breakthrough UVision System 
06/06/2005 Applied Materials Announces Breakthrough at Event in New York City
05/19/2005 Applied Materials Process Diagnostics and Control Group Wins 2004 Supplier Excellence Award from Texas Instruments
05/17/2005 Applied Materials Achieves Major Market Share Gains in 2004
02/25/2005 Applied Materials Slashes Mask Development Time with Industry's First Automated OPC Qualification Tool 
12/14/2004 AMD Orders Applied Materials Systems to Equip 300mm Fab
11/29/2004 Applied Materials Releases Industry's Fastest, Most Powerful Defect Review Systems with New SEMVision G2 Family
07/12/2004 Applied Materials Leads the Semiconductor Equipment Industry in the 65nm Revolution
06/29/2004 Silterra Places Large Order with Applied Materials for Copper Technologies; Production-Ready Systems to Speed Technology Ramp
05/25/2004 Chartered Selects Applied Materials' Advanced Transistor, Low k Interconnect and Inspection Technologies for 300mm Fab
02/25/2004 First 65-nm X Architecture Interconnect Test Chip Produced at Applied Materials` Maydan Technology Center
02/23/2004 Applied Materials Shatters Metrology Roadblocks for 65-45nm Production with Applied VeritySEM System

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