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Metrology and Inspection Technical Articles/Papers
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CD-SEM and DFM Metrology Solutions
SEM-Contour Based OPC Model Calibration through the Process Window, SPIE Advanced Lithography Conference, Feb. 2007 (482KB)
The Impact of Double Patterning on CD-SEM Metrology, SPIE Advanced Lithography Conference, Feb. 2007 (932KB)
MacroCD Contact Ellipticity Measurement for Lithography Tool Qualification, SPIE Advanced Lithography Conference, Feb. 2007 (445KB)
Sub-Nanometer CD-SEM Matching, SPIE Advanced Lithography Conference, Feb. 2007 (508KB)
Physical matching vs CD Matching for CD-SEM, SPIE Advanced Lithography Conference, Feb. 2007 (4.7MB)
Charging Measurement using SEM Embedded Energy Filter, SPIE Advanced Lithography Conference, Feb. 2007 (74KB)
Advanced Edge Roughness Measurement Application for Mask Metrology, SPIE Advanced Lithography Conference, Feb. 2007 (348KB)
CAD based Line/Space Mix-up Prevention for Reticle Metrology, SPIE Advanced Lithography Conference, Feb. 2007 (681KB)
Using design intent to qualify and control lithography manufacturing, SPIE Microlithograhy Conference, Feb 2006 (250KB)
Embedded Charge Investigation: Industry Concerns and Metrology Solutions, SPIE Microlithograhy Conference, Feb 2006 (999KB)
Automatic CD-SEM offline recipe creation for OPC qualification and process monitoring in a DRAM pilot-fab environment, SPIE Microlithograhy Conference, Feb 2006 (265KB)
Advanced CD-SEM matching methodologies for OPC litho cell-based matching verification, SPIE Microlithograhy Conference, Feb 2006 (734KB)
A novel approach to characterize trench depth and profile using the 3D tilt capability of a critical dimension-scanning electron microscopy at 65-nm technology node, SPIE Microlithograhy Conference, Feb 2006 (1.36MB)
Bias reduction in roughness measurement through SEM noise removal, SPIE Microlithograhy Conference, Feb 2006 (276KB)
Small feature accuracy challenge for CD-SEM metrology: physical model solution, SPIE Microlithograhy Conference, Feb 2006 (2.09MB)
Characterization of Memory Capacitor Profiles, SPIE Microlithography Conference, Feb 2005 (1.24MB)
Design Based Metrology: Advanced Automation for CD-SEM Recipe Generation, SPIE Microlithography Conference, Feb 2005 (292KB)
CD-SEM Metrology Macro CD Technology: Beyond the Average, SPIE Microlithography Conference, Feb 2005 (1.69MB)
Advanced Mask Metrology Enabling Full Characterization of Imprint Lithography Templates, SPIE Microlithography Conference, Feb 2005 (683KB)
Examination of Possible Primary Mechanisms for 193nm Resist Shrinkage, SPIE Microlithography Conference, Feb 2005 (484KB)
Impact of Averaging of CD-SEM Measurements on Process Stability in a Full Volume DRAM Production Environment, SPIE Microlithography Conference, Feb 2005 (1.80MB)
Height and Sidewall Angle SEM Metrology Accuracy, Society of Photo-Optical Instrumentation Engineers, February 2004 (839KB)
Contact Hole Edge Roughness: Circles vs. Stars, Society of Photo-Optical Instrumentation Engineers, February 2004 (989KB)
CD SEM Application for Generic Analysis of Two-Dimensional Features on Wafers and Reticles, Society of Photo-Optical Instrumentation Engineers, February 2004 (1.07MB)

Defect Analysis
SEM-Based Library of Immersion-Induced Defect for Fast Baseline Improvement and Excursion Monitoring, SPIE Advanced Lithography Conference, Feb. 2007 (852KB)
Advanced SEM-based Metrology of Systematic Defects, International Symposium on Semiconductor Manufacturing (ISSM), 2005 (1.41MB)
Wafer Current Measurement for Process Monitoring, IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, 2004 (339KB)
Integrated Electrical and SEM-based Defect Characterization for Rapid Yield Ramp, Society of Photo-Optical Instrumentation Engineers, February 2004 (654KB)

Patterned Wafer Inspection
Immersion Lithography Defectivity Analysis, SPIE Advanced Lithography Conference, Feb. 2007 (953KB)
Polarization control for enhanced defect detection on advanced memory devices, SPIE Microlithograhy Conference, Feb 2006 (313KB)
Extending Inspection Limits Using a DUV-Laser-Based Bright-Field Inspection Tool, Micro Magazine, July 2005 (570KB)
Pattern-Related Defects Become Subtler, Deadlier, Semiconductor International, June 2005
Effective Cost-Saving Method of Tool Monitoring Using Product Wafers in 300mm Fabs, IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, May 2004 (400KB)

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