| 12/02/2008 |
Applied Materials’ New Enabler E5 System Solves Critical Contact Etch Challenges for 32nm Memory Chips |
| 12/01/2008 |
Applied Materials Leads the Drive to Accelerate TSV Adoption in 3-Dimensional ICs |
| 12/01/2008 |
Applied Materials Delivers High-Performance TSV Etch with Innovative SilviaTM System |
| 07/14/2008 |
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| 07/17/2007 |
Applied Materials' New Carina System Overcomes Barriers to Etching High-k/Metal Gates |
| 07/17/2007 |
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| 04/17/2007 |
Applied Materials Delivers Critical 45nm Photomask Etch Technology with New Tetra III System |
| 04/03/2007 |
Applied Materials Delivers Record Trench Depths with New Mariana Etch System |
| 12/05/2006 |
Applied Materials' New Opus AdvantEdge System Maximizes Flash and DRAM Etch Productivity |
| 06/05/2006 |
Hoya Selects Applied Materials' Tetra Mask Etcher for 65nm Production |
| 03/28/2006 |
Applied Materials' AdvantEdge Etch System Selected for Advanced Memory Production |
| 12/06/2005 |
Applied Materials Delivers Advanced Solutions for Flash Memory Chip Manufacturing |
| 12/06/2005 |
Applied Materials Introduces AdvantEdge Metal Etch System for Advanced Flash, DRAM Chips |
| 07/12/2005 |
Applied Materials' New AdvantEdge Etch Cuts Transistor CD Variation by 50% to Wafer's Edge |
| 07/07/2005 |
Applied Materials' Enabler Etch System Named Best Product by Semiconductor International Magazine |
| 06/02/2005 |
Applied Materials' Etch Market Share Jumps in 2004 |
| 05/17/2005 |
Applied Materials Achieves Major Market Share Gains in 2004 |
