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Conductor Deposition Press Releases
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07/15/2008 Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System 
09/20/2006 Applied Materials Announces Breakthrough in Interface Engineering Technology for 65-45nm Transistors
07/10/2006 Applied Materials Delivers Key Technology for 45nm Contacts with Endura iLB II System
07/10/2006 New Aktiv Preclean Extends Applied Materials' PVD Barrier-Seed Technology Leadership in 45nm and Beyond
12/06/2005  Applied Materials Announces Advanced CVD Aluminum Technology for Manufacturing Faster Flash and DRAM Chips 
12/06/2005 Applied Materials Delivers Advanced Solutions for Flash Memory Chip Manufacturing
08/15/2005 Applied Materials Strengthens Leadership in 300mm Copper Barrier/Seed with 100th System Shipment
05/17/2004 Applied Materials Advances Transistor Silicide Technology with Applied Endura ALPS Ni PVD
03/23/2004 Applied Materials Expands Leadership in Copper Barrier/Seed Technology with 250 Systems Shipped
02/17/2004  Applied Materials Sets New Benchmark for 300mm High-Volume Manufacturing with Applied Endura2 System 
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