Established as the first single wafer, high current implanter in 65nm production, the Quantum X Plus enables device scaling with increased low energy, high dose performance. Its fixed beam technology combines with a precision mechanical scanning system to provide unique capabilities in Logic and Memory. Quantum X Plus enables defect engineering for ultra-shallow junction formation ≤45nm, while also delivering unparalleled angle precision for advanced memory structures.

Paired with the Applied Vantage RadiancePlus RTP and incorporating state-of-the-art understanding in
co-implantation and defect engineering technology, Quantum X Plus provides the innovative foundations for customers’ present and future high current implant needs.

Features:

	Highest productivity for ultra-shallow junction formation (200eV – 80keV)
	Two-dimensional parallel scanning with StepScan for angle precision and iso-centric scanning for high tilt applications
	Advanced motion control and high density fixed beam for optimal crystal defect management for mobility optimisation
	Predictive and managed uniformity for all implants